| 1. | Analysis on pad effects in chemical mechanical polishing
化学机械抛光中抛光垫作用分析 |
| 2. | Chemical mechanical polishing for mutilevel interconnect in ulsi
多层互连中的化学机械抛光工艺 |
| 3. | Chemical mechanical polishing planarization , cmp
化学机械抛光 |
| 4. | Laser processing and mechanical polishing are used to machining the cvd diamond thick - film
本文对金刚石厚膜的加工工艺过程进行了探索和研究。 |
| 5. | Modeling of chemical mechanical polishing material removal based on molecular - scale mechanism
基于单分子层去除机理的芯片化学机械抛光材料去除模型 |
| 6. | The second key enabling advance , called chemical - mechanical polishing ( or cmp ) , emerged from ibm ' s research labs in the late 1980s
第二项技术，就是化学?机械研磨法（ cmp ） ，是1980年代后期ibm实验室研发出来的。 |
| 7. | Secondly , a novel technology is proposed which includes several key steps such as lpcvd ( low pressure chemical vapor deposition ) nitride silicon and cmp ( chemical mechanical polishing )
其次,设计包含低压淀积氮化硅和化学机械抛光( cmp )等关键步骤的新的soi介质隔离工艺流程。 |
| 8. | Chemical - mechanical polish ( cmp ) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing . it is used during the fabrication process
化学-机械抛光( cmp ) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。 |
| 9. | Chemical - mechanical polish ( cmp ) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing . it is used during the fabrication process
化学-机械抛光( cmp ) -平圆晶光抛和整片的工艺，采用化学移除和机械抛。式方种两光此工艺在前道工艺中使用。 |
| 10. | The electron microscope and raman spectra were used to analyze the diamond films after laser processing . 3 . experimental studies on mechanical polishing diamond film were carried out
并使用现代分析技术，对抛光表面进行sem扫描电镜和拉曼光谱等理化分析，分析了抛光表面的微观表面形态和激光抛光金刚石膜的机理。 |
